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Product Display

 Structure of Panel Packaging Products

   

 Panel and Products of SIPLP Microelectronic

 Advantages of SIPLP’s Advanced Packaging Technology

    Bumping/Copper Pillar middle process is not needed.

    Thick Trace can support bigger current.

    Able to realize 6-side protection and the reliability reaches MSL1. Especially suitable for automobiles electronics.

    Thinner than FC (no substrate or lead frame)

    No Bumping, unnecessary Reflow, seamless connection, better product performance and higher reliability.

    Smaller parasitic effect

    Smaller on-resistance RDSon

    Flexible technology. Especially suitable for MCM multiple chips packaging and power module packaging

    Able to make Copper Clip PQFN and can realize double cooling.

    Especially suitable for embedded passive device of power package, multiple chips package and module package.

    EMI shielding Anti-electromagnetic interference

    One Panel one Lot

    More suitable for the packaging of the third-generation semiconductors such as SiC and GaN.

     

 SiPLP Packaging Way and Main Application Fields