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CSMC Multi Product Wafer (MPW) Service

CSMC MPW service utilized shared silicon wafers among multiple customer (shuttles) to provide a cost effective engineering build solution for prototyping new product designs or for the validation of new IP cells.   Individually sawn die are shipped to customers resulting is dramatically lower cost per die development charge.

CSMC offers frequent shuttles on 0.5um Mixed Mode/BCD, 0.35um Mixed Mode/Logic and 0.18/0.16um/0.13um Logic technologies.  Please consult the following shuttle schedules for timeframes meeting prototype validation requirements.  CSMC also recommends reserve and contact with Sales and Customer Engineering representatives to ensure that GDS files are submitted before GDS Due Date and with adequate checklist information to ensure timely shuttle lot starts.

 

2020 MPW Schedule

If the number of customers to participate in a MPW shuttle is less, CSMC may be postponed to the next MPW shuttle.

Note: Here are some notes of CSMC MPW shuttle, please pay attention
1. Do not provide 12K top metal thickness.
2. Back gridding thickness is 300um.
3. 0.5umFE+0.35umBE &0.5um MIX shuttle need use triple metal process.
4. Don‘t provide fuse option.